The ADG708 and ADG709 are low voltage, CMOS analog multiplexers comprising eight single channels and four differential channels respectively. The ADG708 switches one of eight inputs (S1–S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG709 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF.

Low power consumption and operating supply range of 1.8 V to 5.5 V make the ADG708 and ADG709 ideal for battery-powered, portable instruments. All channels exhibit break-before-make switching action preventing momentary shorting when switching channels.

These switches are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on-resistance and leakage currents. On-resistance is in the region of a few ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either Multiplexers or Demultiplexers, and have an input signal range that extends to the supplies.

The ADG708 and ADG709 are available in a 16-lead TSSOP package.

V_DD to V_SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7 V
V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V
V_SS to GND . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –3.5 V
Analog Inputs² . . . . . . . . . . . . V_SS – 0.3 V to V_DD +0.3 V or
30 mA, Whichever Occurs First
Digital Inputs² . . . . . . . . . . . . . . . . .–0.3 V to V_DD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
. . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B, C Versions) . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . .  150°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . .  432 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . .  150.4°C/W
qJC Thermal Impedance . . . . . . . . . . . . . . . . . . . .  27.6°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
¹Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
²Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.